Visit Bond Telecom at CTIA 2014 in Las Vegas
In September 9-11, Louis Bond Wu will attend CTIA 2014 in Sands Expo, Las Vegas, U.S.A. Our booth No. 4465. Bond Telecom prepared some kinds of surprise free gift for everyone. Warmly welcome to visit our booth, Louis Bond Wu will show you latest model on show.
In the October, Bond Telecom will go to Hongkong for Hongkong Electronics Exhibition as in the past. We attend Hongkong Electronics Exhibition twice a year in April and October.
April: Booth No.:3CF32
October: Booth No.:3CA42
In May-2014, Louis Bond Wu attend SVIAZ/EXPO COMM in Moscow,and Acquired a Complete Success.
Last year,in May 2013,many old and new friends from Indonesia met us at Machinery & Electronics Show.
We met so many old friends and new friends at all exhibition.Especially Hongkong Electronics Exhibition,we are appreciate everyone’s support! In the next October,let’s meet at the old place.
